Semiconductor fabs
captured properly.

Why this building type gets scanned

Tool installs live or die on hookup geometry. We 3D scan fab floors, subfabs, chase levels, and central utility buildings so hookup routing, chase penetrations, and clearance checks are settled before the tool arrives on the dock.

• Tool moves and utility hookups are scheduled in narrow maintenance windows, so process piping, exhaust ductwork, and cable tray routing from the subfab through the waffle slab has to fit on the first installation pass.
• Subfab congestion—high-purity gas lines, vacuum forelines, chilled water headers, and structural pedestals—is the primary physical constraint that legacy 2D drawings never reflect after years of tool changeouts.
• Cleanroom gowning and tool wipe-down protocols make repeated manual tape measurement slow and disruptive; a coordinated tripod LiDAR scan captures the bay, chase, and subfab at 2 to 3 mm station accuracy in a single escorted window.
• Deliverables include registered E57 and Autodesk ReCap (.rcp/.rcs) point clouds alongside clash-ready LOD 300 or LOD 350 Revit (.rvt), IFC, and Navisworks (.nwc/.nwd) models locked to the fab column grid.

How a typical project runs

We walk the site or review drawings and photos, agree the areas and density, and set control. Field work is scheduled around your operations — nights, weekends, or planned outage windows where required. After registration and QA, the deliverable set is produced and reviewed with your team so the files are usable on day one. The full workflow is on our process page.

The deliverable set follows from the questions above. That is high-density laser capture of the floor and subfab, a clash-ready BIM model for hookup routing, and the registered point cloud itself where the tool vendor would rather work from raw data.